Sri Krishna Bhogaraju

CuNex

Sri Krishna Bhogaraju is the Co-Founder and Chief Executive Officer of CuNex GmbH, a technology startup based in Germany that develops advanced copper sintering materials and processes for high-power electronics and optoelectronic packaging. With over seven years of research experience in copper sintering as part of his Doctoral studies and a professional background in the automotive industry during his time at Continental AG, he combines deep technical expertise with practical insights into industrial applications.

He has over 60 publications to his name and multiple patents in the field. His research contributions laid the foundation for CuNex, which was established in collaboration with Schlenk SE. At CuNex, he also leads product development efforts aimed at delivering scalable, low-temperature, and low-pressure copper bonding solutions for next-generation power devices. His work addresses critical challenges in packaging reliability, efficiency, and cost, with the goal of advancing the adoption of wide-bandgap semiconductors and supporting the electrification of energy and transportation systems.